NTEK Group
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400-800-6106
As electronic products become denser and electronics manufacturing moves to lead-free processes, the technology level and quality requirements of PCB and PCBA products face severe challenges, and stricter control of processes and raw materials is needed in PCB design, fabrication and assembly. Because the industry is still in a period of technical and process transition, customers differ considerably in their understanding of PCB processes and assembly, so failures such as leakage, open circuits (traces, holes), poor soldering and board delamination occur frequently. These often cause quality responsibility disputes between suppliers and users and lead to serious economic losses. Failure analysis of PCB and PCBA failure phenomena, together with a series of analytical verifications, identifies the cause of failure and reveals the failure mechanism, which is of great significance for improving product quality, optimising production processes and arbitrating failure incidents.
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